Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics
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United States of America Patent
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Aug 28, 2012
Grant Date -
Jan 8, 2009
app pub date -
Jul 6, 2007
filing date -
Jul 6, 2007
priority date (Note) -
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Abstract
A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.
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