Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
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United States of America Patent
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Aug 28, 2012
Issued Date -
N/A
app pub date -
Aug 10, 2010
filing date -
Aug 12, 2009
priority date (Note) -
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Abstract
A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.
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