Molding device for an expandable interspinous process implant

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8252031
APP PUB NO 20070270829A1
SERIAL NO

11414445

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Abstract

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A molding device is disclosed and can include a first mold component and a second mold component substantially opposite the first mold component. The first mold component and the second mold component can fit around a superior spinous process and an inferior spinous process.

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Patent Owner(s)

  • WARSAW ORTHOPEDIC, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anderson, Kent M Memphis, US 84 9304
Bruneau, Aurelien Memphis, US 55 7631
Carls, Thomas Memphis, US 57 6176
Lange, Eric C Collierville, US 134 14700
Lim, Roy Memphis, US 70 9485
Trieu, Hai H Cordova, US 241 24560

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