Sub-micron decal transfer lithography
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United States of America Patent
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Aug 28, 2012
Grant Date -
Aug 14, 2008
app pub date -
May 5, 2006
filing date -
May 10, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a method of sub-micron decal transfer lithography. The method includes forming a first pattern in a surface of a first silicon-containing elastomer, bonding at least a portion of the first pattern to a substrate, and etching a portion of at least one of the first silicon-containing elastomer and the substrate.
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