Electronic system modules and method of fabrication
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United States of America Patent
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Aug 28, 2012
Grant Date -
Nov 25, 2010
app pub date -
May 24, 2010
filing date -
Sep 7, 2001
priority date (Note) -
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Abstract
A trace routing method for a multi-layer interconnection circuit includes the steps of providing stacked contacts with trace stubs at input/output pads of said interconnection circuit, and limiting contacts between conductive layers to two-level contacts in routing areas where maximum routing density is desired.
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