Method for megasonic processing of an article
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United States of America Patent
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Sep 4, 2012
Grant Date -
Feb 2, 2012
app pub date -
Oct 11, 2011
filing date -
Sep 30, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for megasonic processing of an article. In one aspect, the invention may be a method of processing semiconductor wafers comprising: supporting the semiconductor wafer substantially horizontally; positioning a rod-like probe above an upper surface of the semiconductor wafer in an orientation other than normal to the upper surface of the substrate; applying a fluid to the upper surface of the semiconductor wafer so that a film of the fluid is formed between at least a portion of the rod-like probe and the upper surface of the semiconductor wafer; and vibrating the rod-like probe to transmit energy to the upper surface of the semiconductor wafer via the film of the fluid to loosen particles on the upper surface of the semiconductor wafer.
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