MEMS device and fabrication method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 4, 2012
Grant Date -
Feb 16, 2012
app pub date -
Sep 25, 2008
filing date -
Sep 25, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully