Package-on-package system with via z-interconnections and method for manufacturing thereof
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United States of America Patent
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Sep 4, 2012
Grant Date -
Apr 14, 2011
app pub date -
Dec 16, 2010
filing date -
Mar 19, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A method for manufacturing a package-on-package system includes: providing an interposer substrate; mounting a base substrate under the interposer substrate and having a first integrated circuit die connected thereto; forming an encapsulant between the interposer substrate and the base substrate, the encapsulant encapsulating the first integrated circuit die; and forming a via z-interconnection extending through the encapsulant and one of the substrates to the other of the substrates.
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