Cooling system for high density heat load
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United States of America Patent
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Sep 11, 2012
Grant Date -
Jun 9, 2005
app pub date -
Dec 2, 2004
filing date -
Dec 5, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling cycle can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.
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