IC layers separator

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United States of America Patent

PATENT NO 8261804
SERIAL NO

13283613

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Abstract

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An IC layers separator includes a bed; two sets of two opposite seats secured onto the bed; two guide bars each interconnecting the two opposite seats of either set; a carrier assembly secured onto the bed and including a lower vacuum device and an upper vacuum device including a ramp at one end; an IC layer assembly including an upper layer and a lower layer; and a blade assembly moveably mounted on the guide bars and including a pressing roller pressing the IC layer assembly on the ramp, a spring biased blade for separating the upper layer from the lower layer, and two opposite rolls for conveying the separated upper layer and the lower layer.

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Patent Owner(s)

Patent OwnerAddress
SIGURD MICROELECTRONICS CORPNO 436 SEC 1 PEI-SHING RD CHU-TUNG HSIN-CHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Sheng Chang Taoyuan, TW 2 9

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