Method of detinning Sn plating layer on Cu-based material
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United States of America Patent
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Sep 11, 2012
Grant Date -
Jun 16, 2011
app pub date -
Dec 10, 2010
filing date -
Dec 15, 2009
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Abstract
A Cu-based material 5 is immersed into an alkali hydroxide solution with a concentration of 3.0 to 37.5 mass % and a H2O2 solution with a concentration of 3.0 to 50.0 mass % is added in the alkali hydroxide solution, a temperature of the alkali hydroxide solution when the Cu-based material is immersed ranges from 60 to 105° C., a ratio A/B between a mol number A of alkali hydroxide in the alkali hydroxide solution and a mol number B of H2O2 in the H2O2 solution is 10 or more, and where a mol number of Sn in the Sn layer is C and a mol number of Sn in the CuSn layer is D, B≧C×2+D×6.
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