Surface mounting structure for a surface mounting electronic component

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8263875
APP PUB NO 20080066955A1
SERIAL NO

11901078

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A surface mounting structure for a surface mounting electronic component has an electronic component, a land, a wiring, and an electrical connection pattern. The electronic component has electrodes at opposite ends thereof. The land is connected to each electrode through a solder. The wiring is connected to the land and has a width which is smaller than a width of the electronic component in a width direction thereof. The wiring is connected to the electrical connection pattern. The electrical connection pattern has on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nodo, Takamasa Kariya, JP 4 24
Takagi, Haruo Kariya, JP 8 190

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