Light emitting diode chip package
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United States of America Patent
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Sep 18, 2012
Grant Date -
Jul 24, 2008
app pub date -
Jan 16, 2008
filing date -
Jan 18, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A light emitting diode (LED) chip package including: a package body; an LED chip mounted on the package body and emitting an excited light; a phosphor layer including a phosphor absorbing the excited light and emitting a wavelength conversion light obtained by converting a wavelength of the excited light and a phosphor resin mixed with the phosphor; and a reflector layer including a reflector formed between the LED chip and the phosphor layer, transmitting the excited light to the phosphor layer, and reflecting the wavelength conversion light from the phosphor layer, and a reflector resin mixed with the reflector.
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