Method and apparatus for multilayer support substrate

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United States of America Patent

PATENT NO 8269514
APP PUB NO 20110050265A1
SERIAL NO

12547454

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some embodiments, the reference material may be silicon.

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Patent Owner(s)

  • FORMFACTOR, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hobbs, Eric D Livermore, US 57 859
Mathieu, Gaetan L Varennes, CA 190 12781
Zalar, Frank M Livermore, US 7 10

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