Substrates having voltage switchable dielectric materials
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United States of America Patent
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Sep 25, 2012
Grant Date -
Jul 21, 2011
app pub date -
Jan 19, 2011
filing date -
Jan 27, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.
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