Minimum bond thickness assembly feature assurance

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8272618
APP PUB NO 20060113451A1
SERIAL NO

10904801

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A minimum bond assurance feature for a pi-joint assembly is provided. The pi-joint assembly includes a substructure, a member coupled to the substructure. The substructure includes one or more standoff extending above one of the lower side, the front side and the back side of the substructure. The standoff includes a space location control surface. The member includes a base, a pair of axially elongated leg extending from the base to define a channel therebetween. The channel of the member has a first channel side, a channel floor and a second channel side, wherein the space location control surface may contact the member maintaining a standoff distance between the one of the lower side, the front side and the back side of the substructure and corresponding one of the channel floor, the first channel side and the second channel side of the member. A method of assembling a pi-joint assembly of the present invention is also provided.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
THE BOEING COMPANY100 NORTH RIVERSIDE PLAZA CHICAGO IL 60606-1596

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kilwin, Jeffrey J St. Peters, US 8 101
Newcomer, Ronald J St. Louis, US 2 34

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