High density electrical connector and PCB footprint
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United States of America Patent
Stats
-
Sep 25, 2012
Grant Date -
Sep 1, 2011
app pub date -
Mar 23, 2011
filing date -
Sep 23, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and/or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns.
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