Apparatus and method for reduced delamination of an integrated circuit module
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United States of America Patent
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Sep 25, 2012
Grant Date -
Jul 24, 2008
app pub date -
Jan 20, 2007
filing date -
Jan 20, 2007
priority date (Note) -
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Abstract
An apparatus and method for reducing delamination of an integrated circuit module is disclosed. The integrated circuit module includes a laminate substrate. The integrated circuit module further includes an integrated circuit die operably coupled with the laminate substrate and a plastic semiconductor package overmolded with the laminate substrate. The laminate substrate includes a die attach pad including a plurality of metal oxide regions and non-oxidized metal regions disposed on the die attach pads.
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