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United States of America Patent
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Oct 2, 2012
Grant Date -
Mar 18, 2010
app pub date -
Jun 15, 2009
filing date -
Sep 21, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.
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