Printed circuit board with embedded chip capacitor
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United States of America Patent
Stats
-
Oct 2, 2012
Grant Date -
Jul 28, 2011
app pub date -
Mar 30, 2011
filing date -
Sep 28, 2007
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first electrode connected to the first conductive layer through being seated in a cavity formed between the first conductive layer and the second conductive layer; a filled material, filled in a space excluding a space occupied by the chip capacitor in the cavity; and a via, penetrating the filled material and connecting the second conductive layer to the second electrode of the chip capacitor.
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