Quad flat package with exposed common electrode bars
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United States of America Patent
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-
Oct 9, 2012
Grant Date -
Aug 19, 2010
app pub date -
Apr 23, 2010
filing date -
Jul 18, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic package is provided. The electronic package comprises a die pad having a die attached thereon. A plurality of leads surrounds the die pad and spaced therefrom to define a ring gap therebetween. At least one first common electrode bar is in the ring gap and substantially coplanar to the die pad, in which at least one of the plurality of leads extends to the first common electrode bar. A molding compound partially encapsulates the die pad and the first common electrode bar, such that the bottom surfaces of the die pad and the first common electrode bar are exposed. A length of the first common electrode bar is substantially equal to a predetermined distance between two pads among a plurality of power or ground pads on a side of the die facing the first common electrode bar. An electronic device with the electronic package is also disclosed.
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