Method of manufacturing a wiring board
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United States of America Patent
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Oct 16, 2012
Grant Date -
Oct 22, 2009
app pub date -
Apr 8, 2009
filing date -
Apr 18, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in the slot, such that the terminals of the electrical component face away from the planar temporary bonding means, mounting at least one electrical component on a component foil, such that the terminals of the electrical component face the component foil, mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporary bonding means.
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