Semiconductor chip package including a lead frame
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United States of America Patent
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Oct 16, 2012
Grant Date -
Dec 1, 2011
app pub date -
Aug 11, 2011
filing date -
Apr 16, 2009
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor chip package is provided. The semiconductor chip package includes a lead frame having a chip carrier. A semiconductor chip is mounted on the chip carrier, having a plurality of bonding pads thereon. A package substrate has a cavity therein to accommodate the chip carrier and the semiconductor chip, wherein at least one of the bonding pads of the semiconductor chip is electrically coupled to the package substrate.
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