Materials-based failure analysis in design of electronic devices, and prediction of operating life
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United States of America Patent
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Oct 16, 2012
Grant Date -
Jan 17, 2008
app pub date -
Mar 13, 2007
filing date -
Jan 24, 2006
priority date (Note) -
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Abstract
The technology includes methods, a system, and a computer readable medium for predicting the time to failure of an electronic component, by generating a finite element model of the component, developing a microstructure-based failure model for each representative volume element associated with each node in the finite element model, and calculating a time to failure of the component from the shortest predicted time to failure of any node when a value of a stress variable is applied to the microstructure-based failure model of each node. The technology further includes methods, system, and a medium programmed to predict failure of a system that includes an electronic component, based on predicting time to failure of the component.
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