Thermal expansion compensation method and system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 23, 2012
Grant Date -
Dec 16, 2010
app pub date -
Jun 15, 2010
filing date -
Jun 16, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and system that compensates for thermal induced stresses in structures composed of different materials fastened together. The system utilizes three compensation mounts made from a material with a coefficient of thermal expansion that is between that of the two materials being fastened together. These mounts can be linear or, for a thinner structure, the mounts are “C” shaped. The size of the “C” mounts and fastening locations are calculated based on the coefficient of thermal expansion for the two materials being fastened together and the “C” mount material. The geometry of the “C” mounts allows for fastening the two planar surfaces without introducing a large thickness increase to the structure. This system allows for materials to be fastened together, and when placed in an environment with temperature fluctuations, the system experiences zero, minimal or insignificant amounts of thermal induced stress.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully