Resin forming method and resin forming apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8293165
APP PUB NO 20090224433A1
SERIAL NO

12092828

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A resin forming method and a resin forming apparatus for obtaining a resin formed product, by filling a cavity of a rubber-made mold with a thermoplastic resin, and cooling the thermoplastic resin. When filling the cavity with the thermoplastic resin, an electromagnetic wave generator is used, and electromagnetic waves having an intensity peak in a wavelength region of 0.78 to 2 μm are irradiated to the thermoplastic resin from the surface of the mold, and thereby the thermoplastic resin is heated selectively from the mold. The thermoplastic resin is an ABS resin which either a noncrystalline thermoplastic resin, or is a rubber modified thermoplastic resin.

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Patent Owner(s)

Patent OwnerAddress
TECHNO POLYMER CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Koichi Tokyo, JP 193 2361
Iso, Shinichi Tokyo, JP 3 56
Kurihara, Fumio Tokyo, JP 17 78
Takami, Masamitsu Tokyo, JP 5 19

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