Direct emulsion process for making printed circuits
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United States of America Patent
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Oct 23, 2012
Grant Date -
Jan 22, 2009
app pub date -
Jun 18, 2008
filing date -
May 21, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A direct emulsion process for making printed circuits and printed circuit boards which includes coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, imaging the coated substrate with a circuit design, developing the imaged substrate, and directly plating the developed image onto the coated substrate. Coating solutions which work particularly well in this process include a ferric oxalate and palladium emulsion or a silver based emulsion.
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