LED chip package
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United States of America Patent
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Oct 23, 2012
Grant Date -
Jul 22, 2010
app pub date -
Oct 6, 2009
filing date -
Jan 22, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A LED chip package including a two-phase-flow heat transfer device, at least one LED chip, a metal lead frame and a package material. The two-phase-flow heat transfer device has at least one flat surface. The LED chip is directly or indirectly bonded or adhered to the flat surface of the two-phase-flow heat transfer device. Heat generated by the LED chip can be easily conducted away from the LED chip by the two-phase-flow heat transfer device such as a heat pipe, a vapor chamber and the like so as to prevent heat from accumulating in the LED chip thereby extending the service duration of the LED chip and to prevent the LED chip from deterioration of the light emitting performance caused by the accumulation of heat.
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