Semiconductor device and fabricating method thereof
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United States of America Patent
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Oct 23, 2012
Grant Date -
N/A
app pub date -
May 27, 2010
filing date -
May 27, 2010
priority date (Note) -
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Abstract
A semiconductor device and a fabricating method thereof are provided. In one exemplary embodiment, a plurality of semiconductor dies are mounted on a laminating member, for example, a copper clad lamination, having previously formed conductive patterns, followed by performing operations of encapsulating, forming conductive vias, forming a solder resist and sawing, thereby fabricating a chip size package in a simplified manner. Fiducial patterns are further formed on the laminating member, thereby accurately positioning the semiconductor dies at preset positions of the laminating member.
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