System and method for an adjusting optical proximity effect for an exposure apparatus
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United States of America Patent
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Oct 30, 2012
Grant Date -
Aug 27, 2009
app pub date -
Dec 23, 2008
filing date -
Feb 22, 2008
priority date (Note) -
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Abstract
A method for matching a first OPE curve (700) for a first exposure apparatus (10A) used to transfer an image to a wafer (28) to a second OPE curve (702) of a second exposure apparatus (10B). The method can include the step of adjusting a tilt of a wafer stage (50) that retains the wafer to adjust the first OPE curve. As provided herein, the first exposure apparatus (10A) has the first OPE curve (700) because of the design of the components used in the first exposure apparatus (10A), and the second exposure apparatus (10B) has a second OPE curve (702) because of the design of the components used in the second exposure apparatus (10B). Further, the tilt of the wafer stage (50) can be selectively adjusted until the first OPE curve (700) approximately matches the second OPE curve (702). With this design, the two exposure apparatuses (10A) (10B) can be used for the same lithographic process. Stated in another fashion, exposure apparatuses (10A) (10B) from different manufacturers, when using the same reticle (26), will transfer similar images to the wafer (28).
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