Stackable treated via package and method
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United States of America Patent
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Oct 30, 2012
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N/A
app pub date -
May 25, 2010
filing date -
May 25, 2010
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Abstract
A method of forming a stackable treated via package includes coupling interconnection balls to terminals. The interconnection balls are encapsulated in a package body. Via apertures are formed in the package body to expose the interconnection balls. The interconnection balls are treated to form treated interconnection balls comprising treated surfaces. The treated interconnection balls of the stackable treated via package enhance bonding with interconnection balls of a stacked electronic component package thus maximizing yield.
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