Method for manufacturing multilayer printed circuit board with plated through holes
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United States of America Patent
Stats
-
Nov 6, 2012
Grant Date -
Dec 22, 2011
app pub date -
Apr 28, 2011
filing date -
Jun 18, 2010
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for manufacturing multilayer printed circuit board includes steps below. A first copper clad laminate includes a central portion and a peripheral portion is provided. A group of concentric copper annular collars is formed by etching the peripheral portion. A second copper clad laminate and an adhesive layer is laminated on to the first copper clad laminate in a manner that the adhesive is sandwiched between the first copper clad laminate and the second copper clad laminate to form a multilayer substrate. A detection hole is formed run through the multilayer substrate. An offset distance is determined and plated through holes in the central portion of the multilayer substrate is formed based on the offset distance.
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