Lead frame routed chip pads for semiconductor packages
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United States of America Patent
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Nov 6, 2012
Grant Date -
Jan 6, 2011
app pub date -
Jul 26, 2010
filing date -
Jun 25, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A redistributed lead frame for use in a molded plastic semiconductor package is formed from an electrically conductive substrate by a sequential metal removal process. The process includes patterning a first side of the substrate to form an array of lands separated by channels; disposing a first molding compound within those channels; patterning a second side of the substrate to form an array of chip attach sites and routing circuits electrically interconnecting the array of lands and the array of chip attach sites; directly electrically interconnecting input/output pads on a semiconductor device to the chip attach sites; and encapsulating the semiconductor device, the array of chip attach sites and the routing circuits with a second molding compound. This process is particularly suited for the manufacture of chip scale packages and very thin packages.
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