Electronic component-embedded printed circuit board and method of manufacturing the same
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United States of America Patent
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Nov 6, 2012
Issued Date -
N/A
app pub date -
Jul 22, 2010
filing date -
Apr 26, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.
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