Method for placing at least one component provided with connection points on a substrate, as well as such a device
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United States of America Patent
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Nov 6, 2012
Grant Date -
Jan 8, 2009
app pub date -
Jul 2, 2008
filing date -
Jul 3, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A method for placing at least one component provided with connection points on a substrate. First, positions of the connection points are determined, after which the component is positioned at desired positions on the substrate with the connection points thereof. Upon placement of a number of components, the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components. On the basis of the calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated. Upon placement of a second number of components the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions.
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