Method of manufacturing a circuit board with light emitting diodes
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United States of America Patent
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Nov 13, 2012
Grant Date -
N/A
app pub date -
Jan 16, 2012
filing date -
Jan 16, 2012
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing a circuit board (PCB) with light emitting diodes includes a channel through the PCB to define first and second sides diametrically opposed from each other, a plurality of first legs from the first side towards the second side, and a plurality of second legs from the second side towards the first side, and alternating across the PCB from the first side to the second side the plurality of legs. The channel thus runs along top and bottom edges defined between a pair of adjacent first and second legs. Bridges are provided along the channel physically connecting the first side to the second legs, and/or connecting the second side to the first legs, and/or connecting between the first and second legs. Lastly, LEDs are populated along the sides and legs.
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