Apparatus and method for reducing removal forces for CMP pads
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United States of America Patent
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Nov 13, 2012
Grant Date -
Dec 3, 2009
app pub date -
Aug 4, 2009
filing date -
Jul 29, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to a platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
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