Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof
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United States of America Patent
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Nov 13, 2012
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N/A
app pub date -
Sep 19, 2011
filing date -
Mar 31, 2005
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Abstract
A method for fabricating an encapsulant cavity integrated circuit package system includes: providing an interposer; forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and attaching a component on the interposer in the encapsulant cavity.
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