Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
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United States of America Patent
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-
Nov 13, 2012
Issued Date -
N/A
app pub date -
Dec 9, 2010
filing date -
Mar 27, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A substrate includes an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film. A wiring pattern is adhered to the first surface of the insulating film by an adhesive material. A first portion of the wiring pattern is formed over the penetrating hole, and a part of the adhesive material is formed on an internal wall surface forming the penetrating hole so as not to stop up the penetrating hole. An external electrode contacts the first portion of the wiring pattern and projects through the penetrating hole and extends beyond the second surface of the insulating film.
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