Semiconductor devices including voltage switchable materials for over-voltage protection
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United States of America Patent
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Nov 13, 2012
Grant Date -
Jun 16, 2011
app pub date -
Feb 24, 2011
filing date -
Nov 22, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Semiconductor devices are provided that employ voltage switchable materials for over-voltage protection. In various implementations, the voltage switchable materials are substituted for conventional die attach adhesives, underfill layers, and encapsulants. While the voltage switchable material normally functions as a dielectric material, during an over-voltage event the voltage switchable material becomes electrically conductive and can conduct electricity to ground. Accordingly, the voltage switchable material is in contact with a path to ground such as a grounded trace on a substrate, or a grounded solder ball in a flip-chip package.
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