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Abstract

A method for smart defect review is disclosed. The method includes pre-processing a design layout into a plurality of layout based pattern groups, dividing the design layout into a plurality of cells, overlapping the cells belong to the same layout based pattern groups, extracting a plurality of defect data of all defects on a wafer, constructing a plurality of layout based defect composite pattern groups, executing layout pattern match to obtain each individual layout based defect composite pattern group, performing some defect sample selection rules to each layout based defect composite pattern group, sorting the layout based defect composite pattern groups into different defect types, obtaining a defect image file by reviewing different sample number of defect image from each layout based defect composite pattern group, and generating a defect pattern library or a defect yield prediction by performing a defect yield diagnosis to the defect image file.

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First Claim