Printed circuits and method for making same
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United States of America Patent
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Nov 20, 2012
Issued Date -
N/A
app pub date -
Jul 12, 2010
filing date -
May 21, 2007
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing. One exemplary embodiment of the method for making printed circuit boards includes coating a non-metallized substrate with a palladium based material including a ferric based solution combined with palladium.
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