Flexible and stackable semiconductor die packages having thin patterned conductive layers
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United States of America Patent
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Nov 20, 2012
Issued Date -
N/A
app pub date -
Nov 14, 2008
filing date -
Nov 14, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed are semiconductor die packages, systems, and methods therefor. An exemplary package comprises a patterned conductive layer having a first surface, a second surface, and a first thickness between its first and second surfaces; a semiconductor die disposed over the first surface of the patterned conductive layer and electrically coupled thereto; a plurality of conductive bodies disposed at the second surface of the patterned conductive layer and electrically coupled thereto, each conductive body having a thickness that is greater than the first thickness; and a body of electrically insulating material disposed on the semiconductor die and a portion of the first surface of the patterned conductive layer. A further embodiment farther comprises a second semiconductor die disposed over the second surface of the patterned conductive layer and electrically coupled thereto.
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