Multi-level circuit substrate fabrication method
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United States of America Patent
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Nov 27, 2012
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N/A
app pub date -
May 9, 2008
filing date -
May 1, 2002
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Abstract
A method of making a semiconductor package substrate includes laser-ablating channels in the substrate. After the channels are ablated in the substrate, conductive material is added to fill the channels and cover the surface of the substrate. Then a photomask etching process simultaneously forms a circuit pattern above the surface of the substrate and removes excess metal above the channels, by removing metal above the surface only in patterned regions. The result is a two-level circuit pattern having conductors within and above the substrate.
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