Bonding method and bonding apparatus

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United States of America Patent

PATENT NO 8318585
SERIAL NO

12990608

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Abstract

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To facilitate bonding of articles at a low temperature without degrading electrical contact between the articles.

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Patent Owner(s)

Patent OwnerAddress
SHINKO SEIKI COMPANY LIMITEDKOBE-SHI HYOGO 651-2271
OHNO YASUHIDED-1103 1-1 OGURA SAIWAI-KU KAWASAKI-SHI KANAGAWA 212-0054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hagihara, Taizo Kobe, JP 2 12
Ohno, Yasuhide Kawasaki, JP 17 273
Takeuchi, Tatsuya Kobe, JP 21 187
Taniguchi, Keisuke Kumamoto, JP 7 21

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