Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof
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United States of America Patent
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Nov 27, 2012
Grant Date -
Sep 22, 2011
app pub date -
Jun 1, 2011
filing date -
Feb 21, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Microelectronic devices may be fabricated while being protected from damage by electrostatic discharge. In one embodiment, a shorting circuit is connected to elements of the microelectronic device, where the microelectronic device is part of a chip-on-glass system. In one aspect of this embodiment, a portion of the shorting circuit is in an area of a substrate where a microchip is bonded. In another embodiment, shorting links of the shorting circuit are comprised of a fusible material, where the fusible material may be disabled by an electrical current capable of fusing the shorting links.
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