Straight conductor blind via capture pad structure and fabrication method
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United States of America Patent
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Dec 4, 2012
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N/A
app pub date -
Aug 15, 2007
filing date -
Aug 15, 2007
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Abstract
A capture pad structure includes a first dielectric layer. A trace is embedded within the first dielectric layer. A capture pad is also embedded within the first dielectric layer, the capture pad being an end portion of the trace. A blind via aperture extends partially through the first dielectric layer from a principal surface of the first dielectric layer to the capture pad. By forming the capture pad as the end portion of the trace, formation of the capture pad requires no change in direction or complex motion of the laser.
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