Advanced smart cards with integrated electronics in bottom layer and method of making such advanced smart cards
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United States of America Patent
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Dec 4, 2012
Grant Date -
Jun 30, 2011
app pub date -
Nov 9, 2010
filing date -
Mar 23, 2005
priority date (Note) -
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Abstract
An advanced smart card with a top layer, a core layer of thermoset polymeric material, and a bottom layer comprising an integrated electronics assembly mounted on a substrate. The advanced smart card is formed by positioning a bottom layer in a bottom mold, placing a top layer in a top mold, closing the mold, injecting a thermosetting polymeric material to form a precursor advanced smart card, removing the precursor, and trimming the precursor to produce a finished smart card.
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