Thermally conductive resin composition
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United States of America Patent
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Dec 4, 2012
Grant Date -
Jan 13, 2011
app pub date -
Apr 21, 2009
filing date -
May 8, 2008
priority date (Note) -
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Abstract
The thermally conductive resin composition of the present invention contains (a) a matrix component, (b) a larger-diameter thermally conductive inorganic powder, (c) a smaller-diameter thermally conductive inorganic powder, and (d) a vulcanizing agent and/or curing agent. The surface of the smaller-diameter thermally conductive inorganic powder is selectively treated with a silane compound represented by R(CH3)aSi(OR′)3-a (wherein R is an unsubstituted or substituted organic group having 6 to 20 carbon atoms, R′ is an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1) or a partially hydrolyzed product thereof, and the amount thereof is smaller than the amount necessary to coat the entire surface area of the smaller-diameter thermally conductive inorganic powder. Accordingly, a thermally conductive resin composition that has a low hardness and a high thermal conductivity and that undergoes little outgassing and has storage stability is provided even when large amounts of thermally conductive inorganic powder is loaded into the resin component.
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