Resin for thermal imprint
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United States of America Patent
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Dec 4, 2012
Grant Date -
Jan 21, 2010
app pub date -
Aug 25, 2006
filing date -
Sep 27, 2005
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Abstract
A resin for thermal imprint including a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]>10. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved.
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